Inside Electronics

Sometimes it seems that we are on the verge of adequately commercializing autonomous driving, and then it seems like it'll never happen. We talk about the application space and the technology required with Dr. Stefan Poledna, co-founder, CTO, and CEO of TTTech Auto.

AI and data center growth are putting unprecedented pressure on memory infrastructure, and the industry is feeling the effects. In this episode of Inside Electronics, host Alix Palture speaks with Brian Watson, Marketing Manager for Customized Memory Solutions at Winbond, about the challenges created by the rapid shift toward HBM and DDR5, the ongoing shortage of DDR4, and why legacy memory technologies remain essential for many real-world designs.

Brian shares how Winbond helps customers bridge supply gaps, support long product lifecycles, and deliver performance through solutions like Cube architecture for applications that need bandwidth without the HBM price point. If you want a clear look at the memory pressures shaping AI, data centers, and the broader engineering landscape, this episode is for you.

With the advance of wide-bandgap power semiconductors in the marketplace, many are starting to feel that the time is getting short for silicon-based power electronics. However, the fundamental structure of the silicon power MOSFET remained largely unchanged, and there is still a window of opportunity to develop next-generation devices that can leverage the maturity and expertise of the silicon processing industry. 

One such company, iDEAL Semiconductor, has redefined the legacy structure with its SuperQ advanced REduced SURface Field (RESURF) Silicon Power MOSFET architecture.

Enterprise and Data Center SSD Form Factors (EDSFF) include E1 and E3 that have supplanted the conventional M.2 and 2.5-in form factors like U.2 in high end servers. M.2 slots are often found on motherboards but server removable drives are now dominated by EDSFF that support the latest PCI Express-based NVMe interfaces that provide massive throughput. In this episode, Sebastien Jean, Chief Technology Officer at Phison Electronics, about the history and evolution of drive form factors and how flash memory has changed the form factor design.

For more than six decades, Cinch Connectivity Solutions has addressed the demanding requirements of applications such as space exploration, delivering reliable, cost-effective solutions by leveraging its global team of expert engineers, manufacturing, and sales support. Cinch Connectivity Solutions’ CIN::APSE provides high-reliability, high-performance solderless, high-density interconnects for board-to-board, flex-to-board, and component-to-board applications.